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Layout-aware gate duplication and buffer insertion
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Source Design, Automation, and Test in Europe archive
Proceedings of the conference on Design, automation and test in Europe table of contents
Nice, France
SESSION: Interconnect optimization and metastability table of contents
Pages: 1367 - 1372  
Year of Publication: 2007
ISBN:978-3-9810801-2-4
Authors
D. Bañeres  Universitat Politècnica de Catalunya, Barcelona, Spain
J. Cortadella  Universitat Politècnica de Catalunya, Barcelona, Spain
M. Kishinevsky  Strategic CAD Lab, Intel Corp., Hillsboro, OR
Sponsors
: IEEE Council on Electronic Design Automation (CEDA)
SIGDA: ACM Special Interest Group on Design Automation
: The EDA Consortium
EDAA : European Design and Automation Association
RAS : RAS
: The IEEE Computer Society TTTC
: ECSI
Publisher
EDA Consortium  San Jose, CA, USA
Bibliometrics
Downloads (6 Weeks): 3,   Downloads (12 Months): 22,   Citation Count: 0
Additional Information:

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ABSTRACT

An approach for layout-aware interconnect optimization is presented. It is based on the combination of three sub-problems into the same framework: gate duplication, buffer insertion and placement. Different techniques to control the combinatorial explosion are proposed.

The experimental results show tangible benefits in delay that endorse the suitability of integrating the three sub-problems in the same framework. The results also corroborate the increasing relevance of interconnect optimization in future semiconductor technologies.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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Collaborative Colleagues:
D. Bañeres: colleagues
J. Cortadella: colleagues
M. Kishinevsky: colleagues