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Design closure driven delay relaxation based on convex cost network flow
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Source Design, Automation, and Test in Europe archive
Proceedings of the conference on Design, automation and test in Europe table of contents
Nice, France
SESSION: Communication synthesis under timing constraints table of contents
Pages: 63 - 68  
Year of Publication: 2007
ISBN:978-3-9810801-2-4
Authors
Chuan Lin  Magma Design Automation, Santa Clara, CA
Aiguo Xie  Calypto Design Systems, Santa Clara, CA
Hai Zhou  Northwestern University, Evanston, IL
Sponsors
: IEEE Council on Electronic Design Automation (CEDA)
SIGDA: ACM Special Interest Group on Design Automation
: The EDA Consortium
EDAA : European Design and Automation Association
RAS : RAS
: The IEEE Computer Society TTTC
: ECSI
Publisher
EDA Consortium  San Jose, CA, USA
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Downloads (6 Weeks): 1,   Downloads (12 Months): 15,   Citation Count: 1
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ABSTRACT

Design closure becomes hard to achieve at physical layout stage due to the emergence of long global interconnects. Consequently, interconnect planning needs to be integrated in high level synthesis. Delay relaxation that assigns extra clock latencies to functional resources at RTL (Register Transfer Level) can be leveraged. In this paper we propose a general formulation for design closure driven delay relaxation problem. We show that the general formulation can be transformed into a convex cost integer dual network flow problem and solved in polynomial time using the convex cost-scaling algorithm in [1]. Experimental results validate the efficiency of the approach.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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C. Lin and H. Zhou. Wire retiming as fixpoint computation. IEEE TVLSI, 13(12):1340--1348, December 2005.
 
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C. Lin and H. Zhou. Optimal wire retiming without binary search. IEEE TCAD, 25(9):1577--1588, September 2006.
 
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H. Zhou and C. Lin. Retiming for wire pipelining in system-on-chip. IEEE TCAD, 23(9):1338--1345, September 2004.

Collaborative Colleagues:
Chuan Lin: colleagues
Aiguo Xie: colleagues
Hai Zhou: colleagues