| Decoupling capacitor planning and sizing for noise and leakage reduction |
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International Conference on Computer Aided Design
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Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
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San Jose, California
SESSION: Placement optimization: timing, noise, and power
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Pages: 395 - 400
Year of Publication: 2006
ISBN ~ ISSN:1092-3152 , 1-59593-389-1
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Authors
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Eric Wong
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Georgia Institute of Technology, Atlanta, GA
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Jacob Minz
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Georgia Institute of Technology, Atlanta, GA
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Sung Kyu Lim
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Georgia Institute of Technology, Atlanta, GA
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Downloads (6 Weeks): 6, Downloads (12 Months): 29, Citation Count: 3
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ABSTRACT
Decoupling capacitor (decap) is a popular means to reduce power supply noise in integrated circuits. Since the decaps are usually inserted in the whitespace of the device layer, decap management during the floorplanning stage is desirable. In this paper, we devise the Effective Decap Distance model to analyze how functional blocks are affected by non-neighboring decaps. In addition, we propose a generalized network flow-based algorithm to allocate the whitespace to the blocks and determine the oxide thicknesses for the decaps to be implemented in the whitespace. Experimental results show that our decap allocation and sizing methods can significantly reduce decap budget and leakage power with a small increase in area and wirelength when integrated into 2D and 3D floorplanners.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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S. Zhao, C. Koh, and K. Roy. Decoupling capacitance allocation and its application to power supply noise aware floorplanning. IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 21(1):81--92, 2002.
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Jingjing Fu , Zuying Luo , Xianlong Hong , Yici Cai , Sheldon X.-D. Tan , Zhu Pan, VLSI on-chip power/ground network optimization considering decap leakage currents, Proceedings of the 2005 conference on Asia South Pacific design automation, January 18-21, 2005, Shanghai, China
[doi> 10.1145/1120725.1121005]
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Hiroshi Murata , Kunihiro Fujiyoshi , Shigetoshi Nakatake , Yoji Kajitani, Rectangle-packing-based module placement, Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design, p.472-479, November 05-09, 1995, San Jose, California, United States
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