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Decoupling capacitor planning and sizing for noise and leakage reduction
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Source International Conference on Computer Aided Design archive
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California
SESSION: Placement optimization: timing, noise, and power table of contents
Pages: 395 - 400  
Year of Publication: 2006
ISBN ~ ISSN:1092-3152 , 1-59593-389-1
Authors
Eric Wong  Georgia Institute of Technology, Atlanta, GA
Jacob Minz  Georgia Institute of Technology, Atlanta, GA
Sung Kyu Lim  Georgia Institute of Technology, Atlanta, GA
Sponsors
IEEE-CS : Computer Society
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 6,   Downloads (12 Months): 29,   Citation Count: 3
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ABSTRACT

Decoupling capacitor (decap) is a popular means to reduce power supply noise in integrated circuits. Since the decaps are usually inserted in the whitespace of the device layer, decap management during the floorplanning stage is desirable. In this paper, we devise the Effective Decap Distance model to analyze how functional blocks are affected by non-neighboring decaps. In addition, we propose a generalized network flow-based algorithm to allocate the whitespace to the blocks and determine the oxide thicknesses for the decaps to be implemented in the whitespace. Experimental results show that our decap allocation and sizing methods can significantly reduce decap budget and leakage power with a small increase in area and wirelength when integrated into 2D and 3D floorplanners.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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S. Zhao, C. Koh, and K. Roy. Decoupling capacitance allocation and its application to power supply noise aware floorplanning. IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, 21(1):81--92, 2002.
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A. Fan, A. Rahman, and R. Reif. Copper wafer bonding. Electrochemical Solid-State Letter, 1999.


Collaborative Colleagues:
Eric Wong: colleagues
Jacob Minz: colleagues
Sung Kyu Lim: colleagues