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A high-quality mixed-size analytical placer considering preplaced blocks and density constraints
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Source International Conference on Computer Aided Design archive
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California
SESSION: Placement and floorplanning table of contents
Pages: 187 - 192  
Year of Publication: 2006
ISBN ~ ISSN:1092-3152 , 1-59593-389-1
Authors
Tung-Chieh Chen  National Taiwan University, Taipei, Taiwan
Zhe-Wei Jiang  National Taiwan University, Taipei, Taiwan
Tien-Chang Hsu  National Taiwan University, Taipei, Taiwan
Hsin-Chen Chen  National Taiwan University, Taipei, Taiwan
Yao-Wen Chang  National Taiwan University, Taipei, Taiwan
Sponsors
IEEE-CS : Computer Society
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 10,   Downloads (12 Months): 45,   Citation Count: 12
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ABSTRACT

In addition to wirelength, modern placers need to consider various constraints such as preplaced blocks and density. We propose a high-quality analytical placement algorithm considering wirelength, preplaced blocks, and density based on the log-sum-exp wirelength model proposed by Naylor et al. [20] and the multilevel framework. To handle preplaced blocks, we use a two-stage smoothing technique, Gaussian smoothing followed by level smoothing, to facilitate block spreading during global placement. The density is controlled by white-space re-allocation using partitioning and cut-line shifting during global placement and cell sliding during detailed placement. We further use the conjugate gradient method with dynamic step-size control to speed up the global placement and macro shifting to and better macro positions. Experimental results show that our placer obtains the best published results.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
ICCAD04 Mixed-Size Placement Benchmarks. http://vlsicad.eecs.umich.edu/BK/ICCAD04bench/.
 
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ISPD 2005 Placement Contest. http://www.sigda.org/ispd2005/contest.htm.
 
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ISPD 2006 Program. http://www.ispd.cc/program.html.
 
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J. Gu and X. Huang. Efficient local search with search space smoothing: A case study of the traveling salesman problem (TSP). IEEE Trans. on Systems, Man and Cybernetics, 24(5):728--735, 1994.
 
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D. Hill. US patent 6,370,673: Method and system for high speed detailed placement of cells within an intergrated circuit design. 2002.
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A. B. Kahng and Q. Wang. Implementation and extensibility of an analytic placer. IEEE Trans. on CAD, 24(5), May 2005.
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M. Kleinhans, G. Sigl, F. M. Johannes, and K. J. Antreich. Gordian: VLSI placement by quadratic programming and slicing optimization. IEEE Trans. on CAD, 10(3):356--365, 1991.
 
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W. C. Naylor, R. Donelly, and L. Sha. US patent 6,301,693: Non-linear optimization system and method for wire length and dealy optimization for an automatic electric circuit placer. 2001.
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CITED BY  12

Collaborative Colleagues:
Tung-Chieh Chen: colleagues
Zhe-Wei Jiang: colleagues
Tien-Chang Hsu: colleagues
Hsin-Chen Chen: colleagues
Yao-Wen Chang: colleagues