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Analysis and modeling of CD variation for statistical static timing
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Source International Conference on Computer Aided Design archive
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California
SESSION: Variation modeling table of contents
Pages: 60 - 66  
Year of Publication: 2006
ISBN ~ ISSN:1092-3152 , 1-59593-389-1
Authors
Brian Cline  University of Michigan, Ann Arbor, MI
Kaviraj Chopra  University of Michigan, Ann Arbor, MI
David Blaauw  University of Michigan, Ann Arbor, MI
Yu Cao  Arizona State University, Tempe, AZ
Sponsors
IEEE-CS : Computer Society
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 6,   Downloads (12 Months): 39,   Citation Count: 8
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ABSTRACT

Statistical static timing analysis (SSTA) has become a key method for analyzing the effect of process variation in aggressively scaled CMOS technologies. Much research has focused on the modeling of spatial correlation in SSTA. However, the vast majority of these works used artificially generated process data to test the proposed models. Hence, it is difficult to determine the actual effectiveness of these methods, the conditions under which they are necessary, and whether they lead to a significant increase in accuracy that warrants their increased runtime and complexity. In this paper, we study 5 different correlation models and their associated SSTA methods using 35420 critical dimension (CD) measurements that were extracted from 23 reticles on 5 wafers in a 130nm CMOS process. Based on the measured CD data, we analyze the correlation as a function of distance and generate 5 distinct correlation models, ranging from simple models which incorporate one or two variation components to more complex models that utilize principle component analysis and Quad-trees. We then study the accuracy of the different models and compare their SSTA results with the result of running STA directly on the extracted data. We also examine the trade-off between model accuracy and run time, as well as the impact of die size on model accuracy. We show that, especially for small dies (< 6.6mm x 5.7mm), the simple models provide comparable accuracy to that of the more complex ones, while incurring significantly less runtime and implementation difficulty. The results of this study demonstrate that correlation models for SSTA must be carefully tested on actual process data and must be used judiciously.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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M. Berkelaar, "Statistical Delay Calculation, a Linear Time Method," Proceedings of TAU97, Austin, TX, December 1997.
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H. Chang and S. S. Sapatnekar, "Statistical timing analysis under spatial correlations," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 24, Issue 9 2005.
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J. Cain and C. J. Spanos, "Electrical linewidth metrology for systematic CD variation characterization and causal analysis," Proceedings of SPIE Int. Soc. Opt. Eng. 2003.
 
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C. E. Clark, "The greatest of a finite set of random variables," Operations Research, Volume 9, pp.85--91, 1961.
 
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CITED BY  8

Collaborative Colleagues:
Brian Cline: colleagues
Kaviraj Chopra: colleagues
David Blaauw: colleagues
Yu Cao: colleagues