Carbon nanotube interconnects

ABSTRACT

Based on physical models, circuit models are presented for SWNTs, SWNT-bundles and MWNTs. These models can be used for circuit simulations and compact modeling. It is demonstrated that by customizing CNT interconnects at the local, semiglobal and global levels several major challenges facing GSI systems can potentially be addressed. For local interconnects, mono- or few-layer SWNT interconnects can offer up to 50% reduction in capacitance and power dissipation with considerable improvements in latency if they are short enough (<20μm). For semi-global interconnects, either latency or power dissipation can be substantially improved if bundles of SWNTs are used. The improvements increase as cross-sectional dimensions scale down. For global interconnects, bandwidth density can be improved significantly if MWNTs with large diameters with connections to all shells can be fabricated (up to 66% improvement for 50nm diameter MWNTs).

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INDEX TERMS

Primary Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.1 Types and Design Styles

General Terms:
Design, Performance, Theory

Keywords:
crosstalk, inductance, molecular electronics, quantum wires, repeaters, system analysis and design, system optimization