ACM Home Page
Please provide us with feedback. Feedback
Multi-processor operating system emulation framework with thermal feedback for systems-on-chip
Full text PdfPdf (700 KB)
Source Great Lakes Symposium on VLSI archive
Proceedings of the 17th ACM Great Lakes symposium on VLSI table of contents
Stresa-Lago Maggiore, Italy
Pages: 311 - 316  
Year of Publication: 2007
ISBN:978-1-59593-605-9
Authors
Salvatore Carta  University of Cagliari, Cagliari, Italy
Andrea Acquaviva  University of Urbino, Urbino, Italy
Pablo G. Del Valle  Complutense University of Madrid, Madrid, Spain
David Atienza  LSI/EPFL, Lausanne, Switzerland
Giovanni De Micheli  LSI/EPFL, Lausanne, Switzerland
Fernando Rincon  Ciudad Real, Madrid, Spain
Luca Benini  DEIS/Bologna University, Bologna, Italy
Jose M. Mendias  DACYA/Complutense University of Madrid, Madrid, Spain
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 5,   Downloads (12 Months): 45,   Citation Count: 1
Additional Information:

abstract   references   cited by   index terms   collaborative colleagues  

Tools and Actions: Request Permissions Request Permissions    Review this Article  
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/1228784.1228787
What is a DOI?

ABSTRACT

Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power density, which may lead to thermal runaway if coupled with low-cost packaging and cooling. Hence, mechanisms to efficiently evaluate the effectiveness of advanced thermal-aware operating-system (OS) strategies (e.g. task migration) onto the available MPSoC hardware are needed. In this paper, we propose a new MPSoC OS emulation framework that enables the study of thermal management strategies at the architectural- and OS-levels with the help of a standard FPGA. This framework includes the hardware and software components needed to accurately model complex MPSoCs architectures, and to test the effects of run-time thermal management strategies at the OS/middleware level with real-life inputs. Our results show that migration overhead is negligible w.r.t. temperature timings, enabling the development of thermal-aware migration strategies. Moreover, the effectiveness of the monitoring and feedback mechanism provides an emulation performance only ten times slower than real time.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Aptix. System explore, 2003. http://www.aptix.com.
 
2
ARM. Arm integrator ap, 2004. http://www.arm.com.
3
 
4
 
5
Cadence. Cadence palladium ii, 2005. http://www.cadence.com.
 
6
Emulation and Verification Engineering. Zebu xl and zv models, 2005. http://www.eve-team.com.
 
7
Heron Engineering. Heron mpsoc emulation, 2004. http://www.hunteng.co.uk.
8
 
9
Ahmed Jerraya and Wayne Wolf. Multiprocessor Systems-on-Chips. Morgan Kaufmann, Elsevier, 2005.
 
10
 
11
Berkeley University RAD Lab. Ramp project, 2006. http://radlab.cs.berkeley.edu/wiki/RAMP project idea.
 
12
13
 
14
 
15
uclinux: Embedded linux/microcontroller project, 2006. http://www.uclinux.org/.
 
16
17
18
 
19


Collaborative Colleagues:
Salvatore Carta: colleagues
Andrea Acquaviva: colleagues
Pablo G. Del Valle: colleagues
David Atienza: colleagues
Giovanni De Micheli: colleagues
Fernando Rincon: colleagues
Luca Benini: colleagues
Jose M. Mendias: colleagues