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A routing fabric for monolithically stacked 3D-FPGA
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Source International Symposium on Field Programmable Gate Arrays archive
Proceedings of the 2007 ACM/SIGDA 15th international symposium on Field programmable gate arrays table of contents
Monterey, California, USA
SESSION: Architecture and technology table of contents
Pages: 3 - 12  
Year of Publication: 2007
ISBN:978-1-59593-600-4
Authors
Mingjie Lin  Stanford University, CA
Abbas El Gamal  Stanford University, CA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 11,   Downloads (12 Months): 81,   Citation Count: 3
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ABSTRACT

A previous study on the benefits of monolithically stacked 3D-FPGA has estimated a 3.2x improvement in logic density, a 1.7x improvement in delay, and a 1.7x improvement in dynamic power consumption over a baseline 2D-FPGA with no change in architecture. This paper describes a new routing fabric and shows that a 3D-FPGA using this fabric can achieve a 3.3x improvement in logic density, a 2.35x improvement in delay, and a 2.82x improvement in dynamic power consumption over the same baseline 2D-FPGA. The additional improvements in delay and power consumption are achieved by reducing net loading in several ways: (i) Only Single and Double interconnect segments are used. This reduces the total interconnect length used to implement each net. (ii) The routing fabric is hierarchical. Each logic block's inputs and outputs connect first to local segments. These segments can be then programmably connected to local segments in neighboring routing blocks via programmable buffers and/or to interconnect segments in routing channels via muxes with buffered outputs. (iii) Interconnect segments can be directly connected to form longer segments using programmable buffers without going through routing blocks. (iv) The routing block provides switching capability beyond that of a conventional switch box. A 3D-FPGA using this new routing fabric can be realized by stacking two configuration memory layers and a switch layer on top of a standard CMOS layer with a total of 12 metal layers interspersed between them. A CAD flow based on VPR with appropriate modifications to the routing graph generation and routing algorithm is developed and used in the performance analysis.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Mingjie Lin: colleagues
Abbas El Gamal: colleagues