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Design space exploration for multicore architectures: a power/performance/thermal view
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Source International Conference on Supercomputing archive
Proceedings of the 20th annual international conference on Supercomputing table of contents
Cairns, Queensland, Australia
SESSION: Power-performance table of contents
Pages: 177 - 186  
Year of Publication: 2006
ISBN:1-59593-282-8
Authors
Matteo Monchiero  Politecnico di Milano, Via Ponzio, Milano, Italy
Ramon Canal  Universitat Politècnica de Catalunya, Barcelona, Spain
Antonio González  Universitat Politècnica de Catalunya, Barcelona, Spain and Intel Labs-Universitat, Barcelona, Spain
Sponsors
SIGARCH: ACM Special Interest Group on Computer Architecture
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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ABSTRACT

Multicore architectures are ruling the recent microprocessor design trend. This is due to different reasons: better performance, thread-level parallelism bounds in modern applications, ILP diminishing returns, better thermal/power scaling (many small cores dissipate less than a large and complex one); and, ease and reuse of design.This paper presents a thorough evaluation of multicore architectures. The architecture we target is composed of a configurable number of cores, a memory hierarchy consisting of private L1 and L2, and a shared bus interconnect. We consider parallel shared memory applications. We explore the design space related to the number of cores, L2 cache size and processor complexity, showing the behavior of the different configurations/applications with respect to performance, energy consumption and temperature. Design tradeoffs are analyzed, stressing the interdependency of the metrics and design factors. In particular, we evaluate several chip floorplans. Their power/thermal characteristics are analyzed and they show the importance of considering thermal effects at the architectural level to achieve the best design choice.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
 
2
 
3
R. Kalla, B. Sinharoy, and J. M. Tendler. IBM Power5 Chip: A Dual-Core Multithreaded Processor. IEEE MICRO, pages 40--47, March/April 2004.
 
4
Trevor Mudge. Power: A first class constraint for future architectures. In HPCA '00: Proceedings of the 6th International Symposium on High-Performance Computer Architecture, Washington, DC, USA, 2000. IEEE Computer Society.
5
 
6
Intel. White paper: Superior performance with dual-core. Technical report, Intel, 2005.
 
7
Kelly Quinn, Jessica Yang, and Vernon Turner. The next evolution in enterprise computing: The convergence of multicore x86 processing and 64-bit operating systems-white paper. Technical report, Advanced Micro Devices Inc., April 2005.
 
8
Jose Renau, Basilio Fraguela, James Tuck, Wei Liu, Milos Prvulovic, Luis Ceze, Smruti Sarangi, Paul Sack, Karin Strauss, and Pablo Montesinos. SESC simulator, January 2005. http://sesc.sourceforge.net.
9
 
10
Premkishore Shivakumar and Norman P. Jouppi. CACTI 3.0: An integrated cache timing, power, and area model. Technical Report 2001/2, Western Research Laboratory, Compaq, 2001.
 
11
 
12
M. Ekman and P. Stenstrom. Performance and power impact of issue-width in chip-multiprocessor cores. In ICPP'03: Proceedings of the 2003 International Conference on Parallel Processing, pages 359--369, Washington, DC, USA, 2003. IEEE Computer Society.
13
 
14
 
15
J. Li and J. F. Martinez. Power-performance implications of thread-level parallelism on chip multiprocessors. In ISPASS'05: Proceedings of the 2005 International Symposium on Performance Analysis of Systems and Software, pages 124--134, Washington, DC, USA, 2005. IEEE Computer Society.
 
16
J. Li and J. F. Martinez. Dynamic power-performance adaptation of parallel computation on chip multiprocessors. In HPCA '06: Proceedings of the 12th International Symposium on High Performance Computer Architecture, Washington, DC, USA, 2006. IEEE Computer Society.
 
17
 
18
Y. Li, B. Lee, D. Brooks, Z. Hu, and K. Skadron. CMP design space exploration subject to physical constraints. In HPCA '06: Proceedings of the 12th International Symposium on High Performance Computer Architecture, Washington, DC, USA, 2006. IEEE Computer Society.
19
 
20
K. Sankaranarayanan, S. Velusamy, M. Stan, and K. Skadron. A case for thermal-aware floorplanning at the microarchitectural level. Journal of Instruction Level Parallelism, 2005.
 
21
 
22
 
23
 
24
25
 
26
 
27
Weiping Liao, Lei He, and K. M. Lepak. Temperature and supply Voltage aware performance and power modeling at microarchitecture level. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 24(7):1042.
28
 
29
Man-Lap Li, Ruchira Sasanka, Sarita V. Adve, Yen-Kuang Chen, and Eric Debes. The alpbench benchmark suite for complex multimedia applications. In Proceedings of the IEEE International Symposium on Workload Characterization (IISWC-2005), Washington, DC, USA, 2005. IEEE Computer Society.


Collaborative Colleagues:
Matteo Monchiero: colleagues
Ramon Canal: colleagues
Antonio González: colleagues