Challenges and opportunities in the post single-thread-processor era

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Challenges and opportunities in the post single-thread-processor era

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PACT archive
Proceedings of the 15th international conference on Parallel architectures and compilation techniques table of contents

Seattle, Washington, USA

Pages: 63 - 63

Year of Publication: 2006

ISBN:1-59593-264-X

Author

Steve Scott

Cray Inc., Seattle, Washington

Sponsor

ACM: Association for Computing Machinery

Publisher

ACM New York, NY, USA

Bibliometrics

Downloads (6 Weeks): 7, Downloads (12 Months): 24, Citation Count: 1

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abstract cited by index terms collaborative colleagues

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ABSTRACT

The age of the single thread juggernaut has ended, due to a variety of factors. Multi-core processors are coming on strong, and scaling in being stressed more than ever. This presents a number of architectural, hardware and software challenges. This talk will reflect on these challenges from Cray's perspective in the high performance computing industry.

CITED BY

S. M. Sri-Jayantha , G. McVicker , K. Bernstein , J. U. Knickerbocker, Thermomechanical modeling of 3D electronic packages, IBM Journal of Research and Development, v.52 n.6, p.623-634, November 2008

INDEX TERMS

Primary Classification:
C. Computer Systems Organization
C.1 PROCESSOR ARCHITECTURES
C.1.4 Parallel Architectures