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A design methodology for application-specific networks-on-chip
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Source ACM Transactions on Embedded Computing Systems (TECS) archive
Volume 5 ,  Issue 2  (May 2006) table of contents
Pages: 263 - 280  
Year of Publication: 2006
ISSN:1539-9087
Authors
Jiang Xu  Princeton University, Princeton, NJ
Wayne Wolf  Princeton University, Princeton, NJ
Joerg Henkel  University of Karlsruhe, Germany
Srimat Chakradhar  NEC Laboratories America, Inc., Princeton, NJ
Publisher
ACM  New York, NY, USA
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ABSTRACT

With the help of HW/SW codesign, system-on-chip (SoC) can effectively reduce cost, improve reliability, and produce versatile products. The growing complexity of SoC designs makes on-chip communication subsystem design as important as computation subsystem design. While a number of codesign methodologies have been proposed for on-chip computation subsystems, many works are needed for on-chip communication subsystems. This paper proposes application-specific networks-on-chip (ASNoC) and its design methodology. ASNoC is used for two high-performance SoC applications. The methodology (1) can automatically generate optimized ASNoC for different applications, (2) can generate a corresponding distributed shared memory along with an ASNoC, (3) can use both recorded and statistical communication traces for cycle-accurate performance analysis, (4) is based on standardized network component library and floorplan to estimate power and area, (5) adapts an industrial-grade network modeling and simulation environment, OPNET, which makes the methodology ready to use, and (6) can be easily integrated into current HW/SW codesign flow. Using the methodology, ASNoC is generated for a H.264 HDTV decoder SoC and Smart Camera SoC. ASNoC and 2D mesh networks-on-chip are compared in performance, power, and area in detail. The comparison results show that ASNoC provide substantial improvements in power, performance, and cost compared to 2D mesh networks-on-chip. In the H.264 HDTV decoder SoC, ASNoC uses 39% less power, 59% less silicon area, 74% less metal area, 63% less switch capacity, and 69% less interconnection capacity to achieve 2X performance compared to 2D mesh networks-on-chip.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Jiang Xu: colleagues
Wayne Wolf: colleagues
Joerg Henkel: colleagues
Srimat Chakradhar: colleagues