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LVS verification across multiple power domains for a quad-core microprocessor
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Source ACM Transactions on Design Automation of Electronic Systems (TODAES) archive
Volume 11 ,  Issue 2  (April 2006) table of contents
Pages: 490 - 500  
Year of Publication: 2006
ISSN:1084-4309
Authors
Wei Li  Broadcom Corp., Santa Clara, CA
Daniel Blakely  Broadcom Corp., Santa Clara, CA
Scott Van Sooy  Broadcom Corp., Santa Clara, CA
Keven Dunn  Broadcom Corp., Santa Clara, CA
David Kidd  Broadcom Corp., Santa Clara, CA
Robert Rogenmoser  Broadcom Corp., Santa Clara, CA
Dian Zhou  University of Texas at Dallas, Richardson, TX
Publisher
ACM  New York, NY, USA
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ABSTRACT

A unique LVS (layout-versus-schematic) methodology has been developed for the verification of a four-core microprocessor with multiple power domains using a triple-well 90-nm CMOS technology. The chip is migrated from its previous generation that is for a twin-well process. Due to the design reuse, VDD and GND are designed as global nets but they are not globally connected across the entire chip. The standard LVS flow is unable to handle the additional design complexity and there seems to be no published literature tackling the problem. This paper presents a two-phase LVS methodology: a standard LVS phase where power and ground nets are defined as global nets and a multi-power-domain LVS phase where power and ground nets are treated as local nets. The first phase involves verifying LVS at the block level as well as the full-chip level. The second phase aims at verifying the integrity of the multi-power-domain power grid that is not covered in the first phase LVS. The proposed LVS methodology was successfully verified by real silicon.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Moll, L. 2004. The next-generation line of Broadcom's SiByte#8482; multiprocessor SoCs. In Proceedings of the Fall Microprocessor Forum (San Jose, CA, Oct.).
 
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Sano, B. 2002. Chip combines four 1GHZ cores. In Microprocessor Report.

Collaborative Colleagues:
Wei Li: colleagues
Daniel Blakely: colleagues
Scott Van Sooy: colleagues
Keven Dunn: colleagues
David Kidd: colleagues
Robert Rogenmoser: colleagues
Dian Zhou: colleagues