| Optical routing for 3D system-on-package |
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Design, Automation, and Test in Europe
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Proceedings of the conference on Design, automation and test in Europe: Proceedings
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Munich, Germany
SESSION: Interactive presentation
table of contents
Pages: 337 - 338
Year of Publication: 2006
ISBN:3-9810801-0-6
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European Design and Automation Association
3001 Leuven, Belgium, Belgium
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Downloads (6 Weeks): 4, Downloads (12 Months): 13, Citation Count: 1
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ABSTRACT
Optical interconnects enable faster signal propagation with virtually no crosstalk. In addition, wavelength division multiplexing allows a single waveguide to be shared among multiple interconnects. This paper proposes efficient algorithms for the construction of timing and congestion-driven waveguides considering the optical resource constraints. We develop the first optical router for System-on-Packages (SOPs), which reduce electrical wirelength by 11% and improve performance by 23%, when a single optical layer is introduced for every placement layer.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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R. Tummala, "SOP: what is it and why? a new microsystem-integration technology paradigm-moore's law for system integration of miniaturized convergent systems of the next decade," IEEE Trans. on Advanced Packaging, pp. 241--249, 2004.
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G. Chang, D. Guidotti, F. Liu, Y. Chang, Z. Huang, V. Sundaram, D. Balaraman, S. Hegde, and R. Tummala, "Chip-to-chip optoelectronics sop on organic boards or packages," IEEE Trans. on Advanced Packaging, pp. 386--397, 2004.
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C. Seo, A. Chatterjee, and N. Jokerst, "Physical design of optoelectronic system-on-a-package: a CAD tool and algorithms," in Proc. Int. Symp. on Quality Electronic Design, 2005.
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J. Minz, E. Wong, M. Pathak, and S. K. Lim, "Placement and Routing for 3D System-On-Package Designs," IEEE Trans. on Components and Packaging Technologies, 2005.
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