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Optical routing for 3D system-on-package
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Source Design, Automation, and Test in Europe archive
Proceedings of the conference on Design, automation and test in Europe: Proceedings table of contents
Munich, Germany
SESSION: Interactive presentation table of contents
Pages: 337 - 338  
Year of Publication: 2006
ISBN:3-9810801-0-6
Authors
Jacob R. Minz  Georgia Institute of Technology, Atlanta, GA
Somaskanda Thyagaraja  Georgia Institute of Technology, Atlanta, GA
Sung Kyu Lim  Georgia Institute of Technology, Atlanta, GA
Sponsors
: The EDA Consortium
EDAA : European Design and Automation Association
IEEE-CS\DATC : The IEEE Computer Society
Publisher
European Design and Automation Association  3001 Leuven, Belgium, Belgium
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Downloads (6 Weeks): 4,   Downloads (12 Months): 13,   Citation Count: 1
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ABSTRACT

Optical interconnects enable faster signal propagation with virtually no crosstalk. In addition, wavelength division multiplexing allows a single waveguide to be shared among multiple interconnects. This paper proposes efficient algorithms for the construction of timing and congestion-driven waveguides considering the optical resource constraints. We develop the first optical router for System-on-Packages (SOPs), which reduce electrical wirelength by 11% and improve performance by 23%, when a single optical layer is introduced for every placement layer.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
R. Tummala, "SOP: what is it and why? a new microsystem-integration technology paradigm-moore's law for system integration of miniaturized convergent systems of the next decade," IEEE Trans. on Advanced Packaging, pp. 241--249, 2004.
 
2
G. Chang, D. Guidotti, F. Liu, Y. Chang, Z. Huang, V. Sundaram, D. Balaraman, S. Hegde, and R. Tummala, "Chip-to-chip optoelectronics sop on organic boards or packages," IEEE Trans. on Advanced Packaging, pp. 386--397, 2004.
 
3
C. Seo, A. Chatterjee, and N. Jokerst, "Physical design of optoelectronic system-on-a-package: a CAD tool and algorithms," in Proc. Int. Symp. on Quality Electronic Design, 2005.
 
4
J. Minz, E. Wong, M. Pathak, and S. K. Lim, "Placement and Routing for 3D System-On-Package Designs," IEEE Trans. on Components and Packaging Technologies, 2005.

Collaborative Colleagues:
Jacob R. Minz: colleagues
Somaskanda Thyagaraja: colleagues
Sung Kyu Lim: colleagues