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Analysis and modeling of power grid transmission lines
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Source Design, Automation, and Test in Europe archive
Proceedings of the conference on Design, automation and test in Europe: Proceedings table of contents
Munich, Germany
SESSION: Power grid and large interconnect network analysis table of contents
Pages: 33 - 38  
Year of Publication: 2006
ISBN:3-9810801-0-6
Authors
J. Balachandran  Microwave and RF Systems Group, IMEC vzw, Kapeldreef, Leuven, Belgium
S. Brebels  Microwave and RF Systems Group, IMEC vzw, Kapeldreef, Leuven, Belgium
G. Carchon  Microwave and RF Systems Group, IMEC vzw, Kapeldreef, Leuven, Belgium
T. Webers  Microwave and RF Systems Group, IMEC vzw, Kapeldreef, Leuven, Belgium
W. De Raedt  Microwave and RF Systems Group, IMEC vzw, Kapeldreef, Leuven, Belgium
B. Nauwelaers  Katholieke Universiteit Leuven, ESAT, Kasteelpark Arenberg, Leuven, Belgium
E. Beyne  Microwave and RF Systems Group, IMEC vzw, Kapeldreef, Leuven, Belgium
Sponsors
: The EDA Consortium
EDAA : European Design and Automation Association
IEEE-CS\DATC : The IEEE Computer Society
Publisher
European Design and Automation Association  3001 Leuven, Belgium, Belgium
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Downloads (6 Weeks): 2,   Downloads (12 Months): 18,   Citation Count: 0
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ABSTRACT

Power distribution and signal transmission are becoming key limiters for chip performance in nanometer era. These issues can be simultaneously addressed by designing transmission lines in power grids. The transmission lines are well suited for high quality intra-chip signal transmission at multi gigabit data rates. By having signal lines between the power grids, the VDD and GND lines in the grid can be exploited as return paths besides being used for regular power distribution. This approach also improves wiring density. In this paper, we rigorously analyze and discuss the design considerations for laying transmission lines in power grids. We also present design oriented modeling methods in 2D and 3D geometry. We show how the grid modeling complexity is simplified. We experimentally validate our results with fabricated test structures. We also show VDD lines in the grid act as good return path without external decoupling capacitors in our design. Further we discuss substrate effects and deduce guidelines for designing power grid transmission lines on a low resistive silicon substrate.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
ITRS Roadmap, 2003 edition.
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Sinha, A.; Chowdhury, S., "Mesh-structured on-chip power/ground: design for minimum inductance and characterization for fast R, L extraction", Custom Integrated Circuits Conference, pp. 461--465. May 1999.
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Mezhiba, A. V.; Friedman, E. G., "Electrical characteristics of multi-layer power distribution grids", International Symposium on Circuits and Systems, pp. 473--476, Vol.5, May 2003
 
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E.Beyne "Cu Interconnects and Low-k Dielectrics, Challenges for chip Interconnections and Packaging", IITC, pp. 221--223, June 2003.
 
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Carchon, G. de Raedt, W. Beyne, E "Compensating differences between measurement and calibration wafer in probe-tip calibrations" IEEE MTT-S, Vol.3, pp.1837--1840, June 2002.
 
9
D. M. Pozar, "Microwave Engineering", Reading, MA: Addison-Wesley, 1990
Collaborative Colleagues:
J. Balachandran: colleagues
S. Brebels: colleagues
G. Carchon: colleagues
T. Webers: colleagues
W. De Raedt: colleagues
B. Nauwelaers: colleagues
E. Beyne: colleagues