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An evaluation of the impact of gate oxide tunneling on dual-Vt-based leakage reduction techniques
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Source Great Lakes Symposium on VLSI archive
Proceedings of the 16th ACM Great Lakes symposium on VLSI table of contents
Philadelphia, PA, USA
POSTER SESSION: Poster session 1 table of contents
Pages: 105 - 110  
Year of Publication: 2006
ISBN:1-59593-347-6
Authors
Lara D. Oliver  Duke University, Durham, NC
Krishnendu Chakrabarty  Duke University, Durham, NC
Hisham Z. Massoud  Duke University, Durham, NC
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

We evaluate the effectiveness of dual-Vt design in the presence of both subthreshold leakage and leakage due to gate oxide tunneling. At the device level, we use detailed HSPICE simulation to investigate the total leakage impact of three methods of dual-Vt implementation: multiple channel doping, channel length, and oxide thickness. At the system level, we generate and characterize a standard cell library and apply three representative delay-constrained leakage minimization dual-Vt assignment algorithms to the ISCAS'85 combinational benchmark circuits. Results show that oxide thickness modulation effectively reduces total leakage power consumption, but channel doping and channel length modulation are less effective.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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M. Anis and M. Elmasry, Multi-Threshold CMOS Digital Circuits: Managing Leakage Power Kluwer Publishers, 2003.
 
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Y. Cao, T. Sato, D. Sylvester, M. Orshansky, and C. Hu, "New paradigm of predictive mosfet and inter-connect modeling for early circuit design," in CICC 2000, pp. 201--204.
 
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Collaborative Colleagues:
Lara D. Oliver: colleagues
Krishnendu Chakrabarty: colleagues
Hisham Z. Massoud: colleagues