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ABSTRACT
Temperature-related effects are critical in determining both the performance and reliability of VLSI circuits. Accurate and efficient estimation of the temperature distribution corresponding to a specific circuit layout is indispensable in physical design automation tools. In this paper, we propose a highly accurate fast algorithm for computing the on-chip temperature distribution due to power sources located on the top surface of the chip. The method is a combination of several computational techniques including the Green function method, the discrete cosine transform (DCT), and the table look-up technique. The high accuracy of the algorithm comes from the fully analytical nature of the Green function method, and the high efficiency is due to the application of the fast Fourier transform (FFT) technique to compute the DCT and later obtaining the temperature field for any power source distribution using the pre-calculated look-up table. Experimental results have demonstrated that our method has a relative error of below 1% compared with commercial computational fluid dynamic (CFD) softwares for thermal analysis, while the efficiency of our method is orders of magnitude higher than the direct application of the Green function method.
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CITED BY 11
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Pu Liu , Zhenyu Qi , Hang Li , Lingling Jin , Wei Wu , S. X. -D. Tan , Jun Yang, Fast thermal simulation for architecture level dynamic thermal management, Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design, p.639-644, November 06-10, 2005, San Jose, CA
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Srinivasan Murali , Almir Mutapcic , David Atienza , Rajesh Gupta , Stephen Boyd , Luca Benini , Giovanni De Micheli, Temperature control of high-performance multi-core platforms using convex optimization, Proceedings of the conference on Design, automation and test in Europe, March 10-14, 2008, Munich, Germany
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Srinivasan Murali , Almir Mutapcic , David Atienza , Rajesh Gupta , Stephen Boyd , Giovanni De Micheli, Temperature-aware processor frequency assignment for MPSoCs using convex optimization, Proceedings of the 5th IEEE/ACM international conference on Hardware/software codesign and system synthesis, September 30-October 03, 2007, Salzburg, Austria
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Nicholas Allec , Zyad Hassan , Li Shang , Robert P. Dick , Ronggui Yang, ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits, Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design, November 10-13, 2008, San Jose, California
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