| Simultaneous floorplanning and buffer block planning |
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Asia and South Pacific Design Automation Conference
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Proceedings of the 2003 Asia and South Pacific Design Automation Conference
table of contents
Kitakyushu, Japan
SESSION: Performance driven floorplan
table of contents
Pages: 431 - 434
Year of Publication: 2003
ISBN:0-7803-7660-9
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Downloads (6 Weeks): 0, Downloads (12 Months): 8, Citation Count: 5
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ABSTRACT
As technology advances and the number of interconnections among modules rapidly increases, timing closure and design convergence are the most important concerns. Hence, it is desirable to consider interconnect optimization as early as possible. In this paper, we first address simultaneous floorplanning and buffer block planning (i.e., integrating buffer block planning into floorplanning) for interconnect optimization. Experimental results show that our method can significantly improve the interconnect delay and reduce the number of buffers needed.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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CITED BY 5
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Hsun-Cheng Lee , Yao-Wen Chang , Jer-Ming Hsu , Hannah H. Yang, Multilevel floorplanning/placement for large-scale modules using B*-trees, Proceedings of the 40th conference on Design automation, June 02-06, 2003, Anaheim, CA, USA
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Ou He , Sheqin Dong , Jinian Bian , Yuchun Ma , Xianlong Hong, An effective buffer planning algorithm for IP based fixed-outline SOC placement, Proceedings of the 17th great lakes symposium on Great lakes symposium on VLSI, March 11-13, 2007, Stresa-Lago Maggiore, Italy
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Qing Dong , Bo Yang , Jing Li , Shigetoshi Nakatake, Incremental buffer insertion and module resizing algorithm using geometric programming, Proceedings of the 19th ACM Great Lakes symposium on VLSI, May 10-12, 2009, Boston Area, MA, USA
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