| Noise-aware buffer planning for interconnect-driven floorplanning |
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Asia and South Pacific Design Automation Conference
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Proceedings of the 2003 Asia and South Pacific Design Automation Conference
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Kitakyushu, Japan
SESSION: Performance driven floorplan
table of contents
Pages: 423 - 426
Year of Publication: 2003
ISBN:0-7803-7660-9
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Downloads (6 Weeks): 0, Downloads (12 Months): 4, Citation Count: 2
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ABSTRACT
Crosstalk-induced noise has become a key problem in interconnect optimization when technology improves, spacing diminishes, and coupling capacitance/inductance increases. Buffer insertion/sizing is one of the most effective and popular techniques to reduce interconnect delay and decouple coupling effects. It is traditionally applied to post-layout optimization. However it is obviously infeasible to insert/size hundreds of thousands buffers during the post-layout stage when most routing regions are occupied. Therefore, it is desirable to incorporate buffer planning into floorplanning to ensure timing closure and design convergence. In this paper we first derive formulae of buffer insertion for timing and noise optimization, and then apply the formulae to compute the feasible regions for inserting buffers to meet both timing and noise constraints. Experimental results show that our approach achieves an average success rate of 80.9% (78.2%) of nets meeting timing constraints alone (both timing and noise constraints) and consumes an average extra area of only 0.49% (0.66%) over the given floorplan, compared with the average success rate of 75.6% of nets meeting timing constraints alone and an extra area of 1.33% by the BBP method [3].
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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C. J. Alpert and A. Devgan, S. T. Quay, "Buffer Insertion for Noise and Delay Optimization," IEEE Trans. CAD, Vol. 18, Issue 11, pp. 1633--1645, Nov. 1999.
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Jason Cong , Tianming Kong , David Zhigang Pan, Buffer block planning for interconnect-driven floorplanning, Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design, p.358-363, November 07-11, 1999, San Jose, California, United States
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P. Sarkar and C. K. Koh, "Routability-Driven Repeater Block Planning for Interconnect-Centric Floorplanning," IEEE Trans. on Computer-Aided Design, vol. 20, no. 5, pp, 660--671, May 2001.
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Semiconductor Industry Association, National Technology Roadmap for Semiconductors, 1997.
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Semiconductor Industry Association, National Technology Roadmap for Semiconductors 1999 Edition, Nov. 1999.
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CITED BY 2
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Hsun-Cheng Lee , Yao-Wen Chang , Jer-Ming Hsu , Hannah H. Yang, Multilevel floorplanning/placement for large-scale modules using B*-trees, Proceedings of the 40th conference on Design automation, June 02-06, 2003, Anaheim, CA, USA
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