| Reduction of crosstalk noise by optimizing 3-D configuration of the routing grid |
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Asia and South Pacific Design Automation Conference
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Proceedings of the 2003 Asia and South Pacific Design Automation Conference
table of contents
Kitakyushu, Japan
SESSION: DSM interconnect and gate issues
table of contents
Pages: 49 - 52
Year of Publication: 2003
ISBN:0-7803-7660-9
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Authors
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Atsushi Sakai
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SANYO Electric Co., Ltd., Anpachi-cho, Anpachi-gun, Gifu, Japan
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Takashi Yamada
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SANYO Electric Co., Ltd., Anpachi-cho, Anpachi-gun, Gifu, Japan
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Yoshifumi Matsushita
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SANYO Electric Co., Ltd., Anpachi-cho, Anpachi-gun, Gifu, Japan
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Hiroto Yasuura
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Kyushu University, Kasuga, Fukuoka, Japan
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Downloads (6 Weeks): 1, Downloads (12 Months): 2, Citation Count: 1
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ABSTRACT
In this paper, we propose novel physical design techniques for a sub-quarter micron system-on-a-chip (SoC). By appropriately optimizing the routing grid space or the cell utilization ratio, the coupling effects are almost eliminated. By employing our proposed techniques on a 0.13μm six-layer physical design, the longest path delay is significantly decreased by 15% maximum without the need for process improvement. This significant delay reduction, which corresponds to a half generation of process progress, greatly accelerates the performance of SoCs.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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CITED BY
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Atsushi Sakai , Takashi Yamada , Yoshifumi Matsushita , Hiroto Yasuura, Routing methodology for minimizing 1nterconnect energy dissipation, Proceedings of the 13th ACM Great Lakes symposium on VLSI, April 28-29, 2003, Washington, D. C., USA
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