ACM Home Page
Please provide us with feedback. Feedback
Reduction of crosstalk noise by optimizing 3-D configuration of the routing grid
Full text PdfPdf (213 KB)
Source Asia and South Pacific Design Automation Conference archive
Proceedings of the 2003 Asia and South Pacific Design Automation Conference table of contents
Kitakyushu, Japan
SESSION: DSM interconnect and gate issues table of contents
Pages: 49 - 52  
Year of Publication: 2003
ISBN:0-7803-7660-9
Authors
Atsushi Sakai  SANYO Electric Co., Ltd., Anpachi-cho, Anpachi-gun, Gifu, Japan
Takashi Yamada  SANYO Electric Co., Ltd., Anpachi-cho, Anpachi-gun, Gifu, Japan
Yoshifumi Matsushita  SANYO Electric Co., Ltd., Anpachi-cho, Anpachi-gun, Gifu, Japan
Hiroto Yasuura  Kyushu University, Kasuga, Fukuoka, Japan
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IPSJ : Information Processing Society of Japan
IEICE : Institute of Electronics, Information and Communication Engineers
: IEEE Circuits and Systems Society
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 1,   Downloads (12 Months): 2,   Citation Count: 1
Additional Information:

abstract   references   cited by   collaborative colleagues  

Tools and Actions: Review this Article  
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/1119772.1119782
What is a DOI?

ABSTRACT

In this paper, we propose novel physical design techniques for a sub-quarter micron system-on-a-chip (SoC). By appropriately optimizing the routing grid space or the cell utilization ratio, the coupling effects are almost eliminated. By employing our proposed techniques on a 0.13μm six-layer physical design, the longest path delay is significantly decreased by 15% maximum without the need for process improvement. This significant delay reduction, which corresponds to a half generation of process progress, greatly accelerates the performance of SoCs.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
H. B. Bakoglu, "Circuits, Interconnections, and Packaging for VLSI," Addison-Weslay Publishing Company Inc, 1990.
 
2
L. Gal, "On-Chip Cross Talk - the New Signal Integrity Challenge," Proceedings of CICC'95, pp. 251--254, 1995.
 
3
4
 
5
International Technology Roadmap for Semiconductors 2001 Edition, http://public.itrs.net/Files/2001ITRS/Home.htm.
 
6
P. Larsson and C. Svensson, "Noise in Digital Dynamic CMOS Circuits," IEEE Journal of Solid-State Circuits, vol. 29, pp. 655--662, 1994.
 
7
A. B. Kahng, S. Muddu, and D. Vidhani, "Noise and Delay Uncertainty Studies for Coupled RC Interconnects," Proceedings of IEEE ASIC/SOC conference, pp. 3--8, 1999.
 
8
9
 
10
 
11
 
12
C. Nicoletta, J. Alvarez, E. Barkin, C.-C. Chao, B. R. Johnson, F. M. Lassandro, P. Patel, D. Reid, H. Sánchez, J. Siegel, M. Snyder, S. Sullivan, S. A. Taylor, and M. Vo, "A 450-MHz RISC Microprocessor with Enhanced Instruction Set and Copper Interconnect," IEEE Journal of Solid-State Circuits, pp. 1478--1491, 1999.
13
 
14
15
 
16

Collaborative Colleagues:
Atsushi Sakai: colleagues
Takashi Yamada: colleagues
Yoshifumi Matsushita: colleagues
Hiroto Yasuura: colleagues