| Constant impedance scaling paradigm for interconnect synthesis |
| Full text |
Pdf
(350 KB)
|
| Source
|
International Workshop on System-Level Interconnect Prediction
archive
Proceedings of the 2006 international workshop on System-level interconnect prediction
table of contents
Munich, Germany
SESSION: Physical interconnect analysis and optimization
table of contents
Pages: 99 - 105
Year of Publication: 2006
ISBN:1-59593-255-0
|
|
Authors
|
|
J. Balachandran
|
Microwave and RF Systems Group, Leuven, Belgium
|
|
S. Brebels
|
Microwave and RF Systems Group, Leuven, Belgium
|
|
G. Carchon
|
Microwave and RF Systems Group, Leuven, Belgium
|
|
M. Kuijk
|
Vrije Universiteit Brussel, Brussel, Belgium
|
|
W. De Raedt
|
Microwave and RF Systems Group, Leuven, Belgium
|
|
B. Nauwelaers
|
Katholieke Universiteit Leuven, Leuven, Belgium
|
|
E. Beyne
|
Microwave and RF Systems Group, Leuven, Belgium
|
|
| Sponsors |
|
| Publisher |
|
| Bibliometrics |
Downloads (6 Weeks): 0, Downloads (12 Months): 13, Citation Count: 1
|
|
|
ABSTRACT
On-chip global interconnects perceived as performance limiters for continued scaling of integrated circuits in nano-CMOS regimes highlight the importance of their proper design and optimization. A constant impedance scaling paradigm is proposed for systematic synthesis of complete interconnects physical parameters from system level performance metrics such as delay, power and wiring density. The methodology is illustrated for different system level targets and optimal physical parameters are deduced.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
 |
1
|
|
| |
2
|
G. A. Sai-Halasz, "Performance trends in high-end processors," Proc. IEEE, vol. 84, pp. 20--36, Jan. 1995.
|
| |
3
|
D. Sylvester and C. Hu, "Analytical modeling and characterization of deep-submicron interconnect," Proc. IEEE, vol. 89, pp. 634--664, May 2001.
|
| |
4
|
|
| |
5
|
A. Naeemi, R. Venkatesan, and J. D. Meindl, "Optimal global interconnecting devices for GSI," IEEE Trans. Electron Devices, vol. 50, pp. 980--987, Apr. 2003.
|
| |
6
|
A. Naeemi, J. A. Davis, and J. D. Meindl, "Analysis and optimization of coplanar RLC lines for GSI," IEEE Trans. Electron Devices, pp. 985--994, June 2004.
|
| |
7
|
Li, XC - Mao, JF - Huang, HF - Liu, Y, "Global Interconnect Width and Spacing Optimization for Latency, Bandwidth and Power Dissipation", IEEE Trans. Electron devices, Vol.52, no.10, pp. 2272--2279, Oct. 2005.
|
| |
8
|
|
| |
9
|
J. Balachandran et al., "Constant Impedance Scaling Paradigm for scaling LC transmission lines", Proc. International Symposium on Quality Electronic Design, March 2006.
|
| |
10
|
Richard T. Chang, et.al, "Near Speed of light on-chip Electrical Interconnect", Symposium on VLSI Circuits Digest of Technical papers, 2002.
|
 |
11
|
J. Balachandran , S. Brebels , G. Carchon , T. Webers , W. De Raedt , B. Nauwelaers , E. Beyne, Package level interconnect options, Proceedings of the 2005 international workshop on System level interconnect prediction, April 02-03, 2005, San Francisco, California, USA
[doi> 10.1145/1053355.1053361]
|
| |
12
|
|
| |
13
|
D. Chung, "A Chip-Package Hybrid DLL Loop and Clock Distribution Network for Low-Jitter Clock Delivery" ISSCC Dig. Tech. Papers, pp. 514--516, Feb. 2005.
|
| |
14
|
D. M. Pozar, "Microwave Engineering", Reading, MA: Addison-Wesley, 1990.
|
| |
15
|
T. Sakurai, "Closed expressions for interconnection delay, coupling,and crosstalk in VLSIs," IEEE Trans. Electron Devices, vol. 40, pp.118--124, Jan. 1993.
|
CITED BY
|
|
J. Balachandran , S. Brebels , G. Carchon , W. De Raedt , E. Beyne , M. Kuijk , B. Nauwelaers, Constant Impedance Scaling Paradigm for Scaling LC transmission lines, Proceedings of the 7th International Symposium on Quality Electronic Design, p.387-392, March 27-29, 2006
|
|