| Energy/area/delay trade-offs in the physical design of on-chip segmented bus architecture |
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International Workshop on System-Level Interconnect Prediction
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Proceedings of the 2006 international workshop on System-level interconnect prediction
table of contents
Munich, Germany
SESSION: Prediction and Optimization of global interconnect architectures
table of contents
Pages: 75 - 81
Year of Publication: 2006
ISBN:1-59593-255-0
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Downloads (6 Weeks): 2, Downloads (12 Months): 27, Citation Count: 3
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ABSTRACT
The increasing gap between design productivity and chip complexity, and the emerging Systems-On-Chip (SOC) architectural template have led to the wide utilization of reusable Intellectual Property (IP) cores. The physical design implementation of the macro cells (IP blocks or pre-designed blocks) in general needs to find a well balanced solution among chip area, on-chip interconnect energy and critical path delay. We are especially interested in the entire trade-off curve among these three criteria at the floorplanning stage. We show this concept for a real communication scheme based on segmented bus, rather than just an extreme solution. A fast exploration design flow from the memory organization to the final layout is introduced to explore the design space.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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