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Energy/area/delay trade-offs in the physical design of on-chip segmented bus architecture
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Source International Workshop on System-Level Interconnect Prediction archive
Proceedings of the 2006 international workshop on System-level interconnect prediction table of contents
Munich, Germany
SESSION: Prediction and Optimization of global interconnect architectures table of contents
Pages: 75 - 81  
Year of Publication: 2006
ISBN:1-59593-255-0
Authors
Jin Guo  IMEC v.z.w., Leuven, Belgium
Antonis Papanikolaou  IMEC v.z.w., Leuven, Belgium
Pol Marchal  IMEC v.z.w., Leuven, Belgium
Francky Catthoor  IMEC v.z.w., Leuven, Belgium
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 2,   Downloads (12 Months): 27,   Citation Count: 3
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ABSTRACT

The increasing gap between design productivity and chip complexity, and the emerging Systems-On-Chip (SOC) architectural template have led to the wide utilization of reusable Intellectual Property (IP) cores. The physical design implementation of the macro cells (IP blocks or pre-designed blocks) in general needs to find a well balanced solution among chip area, on-chip interconnect energy and critical path delay. We are especially interested in the entire trade-off curve among these three criteria at the floorplanning stage. We show this concept for a real communication scheme based on segmented bus, rather than just an extreme solution. A fast exploration design flow from the memory organization to the final layout is introduced to explore the design space.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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ARM AMBA bus specification. http://www.arm.com/armwww.ns4/html/AMBA?OpenDocument.
 
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Blast chip 4.0 user guide. Magma Design Automation, pages 271--351.
 
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ST Bus specifications. http://www.stmcu.com/inchtml-pages-STBus_intro.html.
 
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A. Papanikolaou, F. Starzer, M. Miranda, F. Catthoor, and K. Bosschere. Architectural and physical design optimizations for efficient intra-tile communication. In Intnl. System-on Chip Symp. (SoC) Conference Proceedings, November 2005.
 
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K. Heyrman, A. Papanikolaou, F. Catthoor, P. Veelaert, and W. Philips. Energy costs of transporting switch control bits for a segmented bus. In proRISC 2005 Conference Proceedings, 2005.
 
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M.A. Jimenez and M. Shanblatt. Integrating a low-power objective into the placement of macro block-based layouts. In MWSCAS 2001 Conference Proceedings, pages 62--65, August 2001.
 
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M. McFarland. A fast floor planning algorithm for architectural evaluation. In International Conference on Computer Design Conference Proceedings, pages 96--99, October 1989.
 
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H. Murata, K. Fujiyoshi, S. Nakatake, and Y. Kajitani. Vlsi module placement based on rectangle packing by the sequence pare. IEEE Transaction on Computer-Aided Design of Integrated Circuits and Systems, 15(12):1518--1524, December 1996.
 
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A. Papanikolaou, K. Koppenberger, and M. Miranda. Memory communication network exploration for low-power distributed memory organisations. In IEEE Wsh. on Signal Processing Systems (SIPS) Conference Proceedings, pages 176--181. IEEE Press, October 2004.
 
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G. Pei-Ning, T. Takahashi, C. Chung-Kuan, and T. Yoshimura. Floorplanning using a tree representation. IEEE Transactions on Computer-Aided Design of Integrated Circuits and System, 20(2):281--289, February 2001.
 
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Collaborative Colleagues:
Jin Guo: colleagues
Antonis Papanikolaou: colleagues
Pol Marchal: colleagues
Francky Catthoor: colleagues