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Full-chip analysis of leakage power under process variations, including spatial correlations
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 42nd annual Design Automation Conference table of contents
Anaheim, California, USA
SESSION: Impact of process variations on power table of contents
Pages: 523 - 528  
Year of Publication: 2005
ISBN:1-59593-058-2
Authors
Hongliang Chang  University of Minnesota
Sachin S. Sapatnekar  University of Minnesota
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 18,   Downloads (12 Months): 132,   Citation Count: 31
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ABSTRACT

In this paper, we present a method for analyzing the leakage current, and hence the leakage power, of a circuit under process parameter variations that can include spatial correlations due to intra-chip variation. A lognormal distribution is used to approximate the leakage current of each gate and the total chip leakage is determined by summing up the lognormals. In this work, Both subthreshold leakage and gate tunneling leakage are considered. The proposed method is shown to be effective in predicting the CDF/PDF of the total chip leakage. The average errors for mean and sigma values are -1.3% and -4.1%


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Semiconductor Industry Association, "International Technology Roadmap for Semiconductors,"2004. Available at : http://public.itrs.net.

CITED BY  32

Collaborative Colleagues:
Hongliang Chang: colleagues
Sachin S. Sapatnekar: colleagues