Spatially distributed 3D circuit models

ABSTRACT

Spatially distributed 3D circuit models are extracted with a segment-to-segment BEM (Boundary Element Method) algorithm for both capacitance and inverse inductance couplings rather than using the traditional net-to-net approach. Critical issues regarding the extraction efficiency and accuracy of segment-to-segment BEM capacitance models are explored. An adaptive discretization scheme is developed for segment-to-segment capacitance extraction and also applied to segment-to-segment high-frequency inverse inductance extraction. We demonstrate the limitations of the duality between capacitance and inverse inductance. Examples demonstrating the accuracy of these models are presented for real packaging cases.

REFERENCES

• 1: Fangqing Yu , Weiping Shi, A Divide-and-Conquer Algorithm for 3D Capacitance Extraction, Proceedings of the 5th International Symposium on Quality Electronic Design, p.253-258, March 22-24, 2004
• 2: Byron Krauter , Lawrence T. Pileggi, Generating sparse partial inductance matrices with guaranteed stability, Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design, p.45-52, November 05-09, 1995, San Jose, California, United States
• 3: Anirudh Devgan , Hao Ji , Wayne Dai, How to efficiently capture on-chip inductance effects: introducing a new circuit element K, Proceedings of the 2000 IEEE/ACM international conference on Computer-aided design, November 05-09, 2000, San Jose, California
• 4: Hao Ji , Anirudh Devgan , Wayne Dai, KSim: a stable and efficient RKC simulator for capturing on-chip inductance effect, Proceedings of the 2001 conference on Asia South Pacific design automation, p.379-384, January 2001, Yokohama, Japan [doi>10.1145/370155.370415]
• 5: M. Beattle , L. Pileggi, Efficient inductance extraction via windowing, Proceedings of the conference on Design, automation and test in Europe, p.430-436, March 2001, Munich, Germany
• 6: Z. Zheng , L. Pileggi , M. Beattie , B. Krauter, Window-Based Susceptance Models for Large-Scale RLC Circuit Analyses, Proceedings of the conference on Design, automation and test in Europe, p.628, March 04-08, 2002
• 7: Michael W. Beattie , Lawrence T. Pileggi, Bounds for BEM capacitance extraction, Proceedings of the 34th annual conference on Design automation, p.133-136, June 09-13, 1997, Anaheim, California, United States [doi>10.1145/266021.266049]
• 8: M. Beattie, L. Pileggi, Error Bounds for Capacitance Extraction via Window Techniques, IEEE TCAD, vol. 18, No. 3 (Mar. 1999)
• 9: K. Nabors, J. White, FASTCAP: A Multipole Accelerated 3-D Capacitance Extraction Program, IEEE TCAD, vol. 10, No. 11 (Nov. 1991)
• 10: Weiping Shi , Jianguo Liu , Naveen Kakani , Tiejun Yu, A fast hierarchical algorithm for 3-D capacitance extraction, Proceedings of the 35th annual conference on Design automation, p.212-217, June 15-19, 1998, San Francisco, California, United States [doi>10.1145/277044.277101]
• 11: T. Chen, C. Luk, C. Chen, INDUCTWISE: Inductance-Wise Interconnect Simulator and Extractor, IEEE TCAD, vol. 22, No. 7 (Jul. 2003)
• 12: J. Jackson, Classical Electrodynamics, 2nd Edition, John Wiley & Sons, New York (1975)
• 13: W. Weeks, L. Wu, M. McAllister, A. Singh, Resistive and inductive skin effect in rectangular conductors, IBM J. Res. Dev., vol. 30, No. 6 (Nov. 1979)

INDEX TERMS

Primary Classification:
  J. Computer Applications
  J.6 COMPUTER-AIDED ENGINEERING
      Subjects: Computer-aided design (CAD)

General Terms:
Design, Theory, Verification

Keywords:
boundary element method (BEM), capacitance, distributed circuit models, inverse inductance