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Variability and energy awareness: a microarchitecture-level perspective
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 42nd annual Design Automation Conference table of contents
Anaheim, California, USA
SESSION: Microarchitecture-level power analysis and optimization techniques table of contents
Pages: 11 - 16  
Year of Publication: 2005
ISBN:1-59593-058-2
Authors
Diana Marculescu  Carnegie Mellon University, Pittsburgh, PA
Emil Talpes  Carnegie Mellon University, Pittsburgh, PA
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 3,   Downloads (12 Months): 30,   Citation Count: 20
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ABSTRACT

This paper proposes microarchitecture-level models for Within Die (WID) process and system parameter variability that can be included in the design of high-performance processors. Since decisions taken at microarchitecture level have the largest impact on both performance and power, on one hand, and global variability effect, on the other hand, models and associated metrics are needed for their joint characterization and analysis. To assess how these variations affect or are affected by microarchitecture decisions, we propose a joint performance, power and variability metric that is able to distinguish among various design choices. As a design-driver for the modeling methodology, we consider a clustered high-performance processor implementation, along with its Globally Asynchronous, Locally Synchronous (GALS) counterpart. Results show that, when comparing the baseline, synchronous and its GALS counterpart, microarchitecture-driven impact of process variability translates into 2-10% faster local clocks for the GALS case, while when taking into account the effect of on-chip temperature variability, local clocks can be 8-18% faster. If, in addition, voltage scaling (DVS) is employed, the GALS architecture with DVS is 26% better in terms of the joint quality metric employing energy, performance, and variability.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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K.A. Bowman, S.G. Duvall, J.M. Meindl, "Impact of Die-to-Die and WIthin-Die Parameter Fluctuations on the Maximum Clock Frequency Distribution for Gigascale Integration," in IEEE Journal of Solid-State Circuits, vol.37, no.2, Feb.2002.
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J. Tschanz, J.T. Kao, S.G. Narendra, R. Nair, D.A. Antoniadis, A.P. Chandrakasan, V. De, "Adaptive Body Bias for Reducing Impacts of Die-to-Die and Within-Die Parameter Variations on Microprocessor Frequency and Leakage," in IEEE Jrnl of Solid-State Circuits, v.37, n.11, Nov 2002.

CITED BY  21

Collaborative Colleagues:
Diana Marculescu: colleagues
Emil Talpes: colleagues