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Accounting for the skin effect during repeater insertion
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Source Great Lakes Symposium on VLSI archive
Proceedings of the 15th ACM Great Lakes symposium on VLSI table of contents
Chicago, Illinois, USA
SESSION: Interconnect table of contents
Pages: 32 - 37  
Year of Publication: 2005
ISBN:1-59593-057-4
Authors
Daniel A. Andersson  Chalmers University of Technology, Göteborg, Sweden
Lars J. Svensson  Chalmers University of Technology, Göteborg, Sweden
Per Larsson-Edefors  Chalmers University of Technology, Göteborg, Sweden
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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ABSTRACT

Since the skin effect will increase the propagation delay in an interconnect, it will also affect how to optimally select the number and size of the buffers. Failing to include the skin effect during buffer design may result in as much as 35% extra delay compared to the optimal repeater chain. We present a new method with closed-form expressions for repeater insertion where we take into account the skin effect and also the relationship between interconnect resistance, capacitance and inductance that are determined from the geometrical parameters. We also investigate the skin-effect influence on power dissipation for an optimally designed repeater chain, and find that the increase is at most 10% of the dynamic power dissipation.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Daniel A. Andersson: colleagues
Lars J. Svensson: colleagues
Per Larsson-Edefors: colleagues