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On-chip power distribution grids with multiple supply voltages for high performance integrated circuits
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Source Great Lakes Symposium on VLSI archive
Proceedings of the 15th ACM Great Lakes symposium on VLSI table of contents
Chicago, Illinois, USA
SESSION: Plenary session table of contents
Pages: 2 - 7  
Year of Publication: 2005
ISBN:1-59593-057-4
Authors
Mikhail Popovich  University of Rochester, Rochester, New York
Eby G. Friedman  University of Rochester, Rochester, New York
Michael Sotman  Technion -- Israel Institute of Technology, Haifa, Israel
Avinoam Kolodny  Technion -- Israel Institute of Technology, Haifa, Israel
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 9,   Downloads (12 Months): 35,   Citation Count: 5
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ABSTRACT

Multiple supply voltages are often utilized to decrease power dissipation in high performance integrated circuits. On-chip power distribution grids with multiple supply voltages are discussed in this paper. A power distribution grid with multiple supply voltages and multiple grounds is presented. The proposed power delivery scheme reduces power supply voltage drops as compared to conventional power distribution systems with dual supplies and a single ground by 17% on average (20% maximum). For an example power grid with decoupling capacitors placed between the power supply and ground, the proposed grid with multiple supply and multiple ground exhibits, respectively, 13% and 18% average performance improvement. The proposed power distribution grid can be an alternative to a single supply voltage and single ground power distribution system.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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A. V. Mezhiba and E. G. Friedman, Power Distribution Networks in High Speed Integrated Circuits, Kluwer Academic Publishers, 2004.
 
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A. V. Mezhiba and E. G. Friedman, "Electrical Characteristics of Multi-Layer Power Distribution Grids," Proceedings of the IEEE International Symposium on Circuits and Systems, Vol. 5, pp. 25--28, May 2003.
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J.-S. Wang, S.-J. Shieh, J.-C. Wang, and C.-W. Yeh, "Design of Standard Cells Used in Low-Power ASIC's Exploiting the Multiple-Supply-Voltage Scheme," Proceedings of the IEEE International ASIC Conference, pp. 119--123, September 1998.
 
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K. Usami et al., "Automated Low-Power Technique Exploiting Multiple Supply Voltages Applied to a Media Processor," IEEE Journal of Solid-State Circuits, Vol. 33, Issue 3, pp. 463--472, March 1998.
 
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M. Kamon, M. J. Tsuk, and J. White, "FastHenry: A Multipole-Accelerated 3-D Inductance Extraction Program," IEEE Transactions on Microwave Theory and Techniques, Vol. 24, No. 9, pp. 1750--1758, September 1994.
 
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E. B. Rosa, "The Self and Mutual Inductance of Linear Conductors," Bulletin of the National Bureau of Standards, Technical Paper Reprint Number 80, Vol. 4, No. 2, pp. 301--344, Government Printing Office, Washington, January 1908.
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M. Popovich and E. G. Friedman, "Impedance Characteristics of Decoupling Capacitors in Multi-Power Distribution Systems," Proceedings of the IEEE International Conference on Electronics, Circuits and Systems, December 2004.
 
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M. Popovich and E. G. Friedman, "Decoupling Capacitors for Power Distribution Systems with Multiple Power Supply Voltages," Proceedings of the IEEE SOC Conference, pp. 331--334, September 2004.


Collaborative Colleagues:
Mikhail Popovich: colleagues
Eby G. Friedman: colleagues
Michael Sotman: colleagues
Avinoam Kolodny: colleagues