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ABSTRACT

300 mm semiconductor wafer fabrication facilities, like conventional semiconductor fabs, contain many different types of tools. In this paper we discuss a realistic way of representing cluster tools in a simulation model of the entire line. A more realistic representation of cluster tools results in greater accuracy in the output of the simulation model.

REFERENCES

• 1: Brooks Automation, Inc., AutoSimulations Division. 2001. AutoSched AP Customization Guide v 7.0.
• 2: Campbell, P., and G. Laitinen. 1997. Overhead Intrabay Automation and Microstocking - a virtual fab case study. In Proceedings of the IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, 368--372. Cambridge, MA.
• 3: Campbell, P., and M. Norman. 1998. Microstocking and Fab Throughput. In Proceedings of the AutoSimulations '98 Symposium, 101--106. Bountiful, UT.
• 4: Campbell, P., and M. Norman. 1999. Simulation Used To Model And Test Improvements In 300 Mm Fab Throughput. Available online via <http://www.semicondutoronline.com>.
• 5: Philip L. Campbell , Darius Rohan , Edward A. MacNair, A model of a 300mm wafer fabrication line, Proceedings of the 31st conference on Winter simulation: Simulation---a bridge to the future, p.909-911, December 05-08, 1999, Phoenix, Arizona, United States [doi>10.1145/324138.324554]
• 6: Mathias A. Dümmler, Using simulation and genetic algorithms to improve cluster tool performance, Proceedings of the 31st conference on Winter simulation: Simulation---a bridge to the future, p.875-879, December 05-08, 1999, Phoenix, Arizona, United States [doi>10.1145/324138.324542]
• 7: Nirmal Govind , David Fronckowiak, Process equipment modeling: resident-entity based simulation of batch chamber tools in 300mm semiconductor manufacturing, Proceedings of the 35th conference on Winter simulation: driving innovation, December 07-10, 2003, New Orleans, Louisiana
• 8: Eric J. Koehler , Timbur M. Wulf , Alvin C. Bruska , Marvin S. Seppanen, Evaluation of cluster tool throughput for thin film head production, Proceedings of the 31st conference on Winter simulation: Simulation---a bridge to the future, p.714-719, December 05-08, 1999, Phoenix, Arizona, United States [doi>10.1145/324138.324465]
• 9: H. Todd LeBaron , Ruth Ann Hendrickson, Semiconductor process equipment modeling: using emulation to validate a cluster tool simulation model, Proceedings of the 32nd conference on Winter simulation, December 10-13, 2000, Orlando, Florida
• 10: H. Todd LeBaron , Mark Pool, The simulation of cluster tools: a new semiconductor manufacturing technology, Proceedings of the 26th conference on Winter simulation, p.907-912, December 11-14, 1994, Orlando, Florida, United States
• 11: Norman, M., and J. Barksdale. 1999. Integrated Manufacturing and Material Handling Simulation Modeling. In Proceedings of the SIMULATION Solutions '99 Conference. Mesa, AZ.
• 12: Sameer T. Shikalgar , David Fronckowiak , Edward A. MacNair, Wafer fabrication: 300mm wafer fabrication line simulation model, Proceedings of the 34th conference on Winter simulation: exploring new frontiers, December 08-11, 2002, San Diego, California