2.5D system integration: a design driven system implementation schema

ABSTRACT

This paper investigates a 3D die-stacking based VLSI integration strategy, so-called 2.5D integration, which can potentially overcome many problems stumbling the development of monolithic System-on-Chip (SoC). In this paper, we review available fabrication technologies and testing solutions for the new integration strategy. We also propose a design driven system implementation schema for this new integration strategy. A layout synthesis framework is under development by us to analyze typical "what if" questions and resolve major physical attributes for a 2.5D system according to the design specification and constraints.

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INDEX TERMS

Primary Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS

Additional Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.1 Types and Design Styles

General Terms:
Design, Performance

Keywords:
2.5D System Integration, 3D stacking, 3D-IC