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Reliable communication in systems on chips
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 41st annual Design Automation Conference table of contents
San Diego, CA, USA
SESSION: Reliable system-on-a-chip design in the nanometer era table of contents
Pages: 77 - 77  
Year of Publication: 2004
ISBN:1-58113-828-8
Author
Giovanni De Micheli  Stanford University, Stanford, CA
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

System on Chip (SoC) design faces several challenges which are due to the extremely small nature of electronic devices and the consequent opportunity to realize multi-processing systems of extremely high complexity. To manage large scale design, SoCs are assembled out of complex standard parts, such as programmable cores and memory arrays. Thus, the major design challenge is to provide correct and reliable operation of the interconnected components. Top-down correct component interconnection will become increasingly harder to succeed, because the interface features of components will also scale-up in complexity. New design methodologies will need to leverage component self-configuration and adaptation to the underlying communication fabric.


REFERENCES

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