Rapid prototyping using high density interconnects

ABSTRACT

This paper introduces the (DIODES) system for the rapid prototyping of DSP electronic systems. DIODES merges silicon compiler and high-density interconnect technology with the goal of prototyping hardware systems as quickly as possible --- within one day. Working from a high-level algorithmic description of a DSP algorithm, DIODES will determine which chips from an inventory of specially designed chips are needed to implement the design. These chips are then placed on a prepared substrate and routed together using computer controlled laser lithography to produce a hardware implementation of the design.

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