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Test data compression using dictionaries with selective entries and fixed-length indices
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Source ACM Transactions on Design Automation of Electronic Systems (TODAES) archive
Volume 8 ,  Issue 4  (October 2003) table of contents
Pages: 470 - 490  
Year of Publication: 2003
ISSN:1084-4309
Authors
Lei Li  Duke University, Durham, NC
Krishnendu Chakrabarty  Duke University, Durham, NC
Nur A. Touba  University of Texas, Austin, TX
Publisher
ACM  New York, NY, USA
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ABSTRACT

We present a dictionary-based test data compression approach for reducing test data volume in SOCs. The proposed method is based on the use of a small number of ATE channels to deliver compressed test patterns from the tester to the chip and to drive a large number of internal scan chains in the circuit under test. Therefore, it is especially suitable for a reduced pin-count and low-cost DFT test environment, where a narrow interface between the tester and the SOC is desirable. The dictionary-based approach not only reduces test data volume but it also eliminates the need for additional synchronization and handshaking between the SOC and the ATE. The dictionary entries are determined during the compression procedure by solving a variant of the well-known clique partitioning problem from graph theory. Experimental results for the ISCAS-89 benchmarks and representative test data from IBM show that the proposed method outperforms a number of recently-proposed test data compression techniques. Compared to the previously proposed test data compression approach based on selective Huffman coding with variable-length indices, the proposed approach generally provides higher compression for the same amount of hardware overhead.


REFERENCES

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Chandra, A. and Chakrabarty, K. 2001b. System-on-a-chip test data compression and decompression architectures based on Golomb codes. IEEE Trans. Computer-Aided Design 20, 355--368.
 
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El-Maleh, A. and Al-Abaji, R. 2002. Extended frequency-directed run-length codes with improved application to system-on-a-chip test data compression. In Proceedings of the International Conference on Electronics, Circuits and Systems. 449--452.
 
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CITED BY  7
 
 
 
 

Collaborative Colleagues:
Lei Li: colleagues
Krishnendu Chakrabarty: colleagues
Nur A. Touba: colleagues

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