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Realistic fault modeling for VLSI testing
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 24th ACM/IEEE Design Automation Conference table of contents
Miami Beach, Florida, United States
Pages: 173 - 180  
Year of Publication: 1987
ISBN:0-8186-0781-5
Author
W. Maly  Department of Electrical and Computer Engineering, Carnegie-Mellon University, Pittsburgh, Pennsylvania
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 5,   Downloads (12 Months): 56,   Citation Count: 15
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ABSTRACT

Functional failures of VLSI circuits are caused by process-induced defects. Such defects have very complex physical characteristics and may be significantly different from the simplistic defect models assumed by typical fault modeling techniques. In the tutorial an overview of the actual mechanisms causing processing defects, and the defects' electrical manifestations will be discussed. It will be demonstrated that inadequate insight into the physics of processing defects and the manufacturing process may lead to inefficient testing of actual VLSI circuits.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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W.Maly, A.J. Strojwas, and S.W. Director, "VLSI Yield Prediction and Estimation: A Unified Framework", IEEE Trans. on Computer Aided Design, No. 1, January 1986, pp. 114-130.
 
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J. Doi, W. M aly, and M. E. Thomas , "Detection and Physical Characterization of Spot Defects in Metal IC Int, erconnections ", To be published.
 
4
C. H. Stapper, "Yield Model for 256K RAMs and Beyond", Proe. of 198P International Solid-State Circuits Conference, 1982, pp. 12-13.
 
5
P. Oangatirkar, R. Presson, and L. Rosner, "Test/Characterization Procedures for High Density Silicon RAMs ", IEEE International Solid-State Circuit8 Conference Digest of Technical Papers, 1982, pp. 62-63.
 
6
C. H. Stapper, R. M. Amstrong and K. Sail, "Integrated Circuit Yield Statistics", Proe. of the IEEE, VoI. 71, No. 4, April 1983, pp. 453-470.
 
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W. Maly, 13. Trifilo, R. Hughes, and A. Miler , "Yield Diagnosis Through Interpretatiort of Tester Data ", To be published.
 
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B. Courtois, Failure mechanisms, fault hypotheses and analytical te,~ting of LSI-NMOS (lIMOS) circuits, Academic, New York, 1981, in VLSI 81
 
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R. L. Wadsack, "Fault Modeling and Logic Simulation of CMOS and MOS Integrated Circuits", The Bell System Technical Journal, Vol. 57, No. 5, May-June 1978, pp. 1449-1474.
 
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J. Galiay, Y. Crouzet and M. Vergniault, "Physical vers~s logical fault models MOS LSI circuits: Impact on their testability", IEEE Trans. Compu., Vol. C-29, June 1980, p~. 527-531. i
 
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W. Maly, Atalas of I0 Technologies: An Introduction ito VLSI Processe,~, The Benjamin/Cummings Publishing Company, Inc., Menlo Park, California, 1987.
 
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Y. Tamir and C.H. Sequin, "Design and Application of Se~f- Testing Comparators Implemented with MOS PLA's", IEEE Trans. on Computers, Vol. C-33, No. 6, June 1984, pp. 493-506.
 
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C.H. Sequin and Y. Tamir, Fault Tolerant VLSI Multieomputers in VLSI CAD Tools and Applications, Editors W. Fichtner and M. Morf), Kluwer Academic Publishers, Boston, Massachusett,~ , The Kluwer International Series in Engineering and Computer Science , 1987.
 
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M. Syrzycki , "Modelling of Spot Defects in MOS Transistor ", To be published.
 
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C.H.Stapper , '~Modeling of Integrated Circuit Defect Sensit, ivitie~ ", IBM J. Res. Develop. , Vol. 27 , No. 6, November 1983, pp. 549-557.
 
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W.Maly, "Modeling of Lithography Related Yield Losses for CAD of VLSI Circuits", IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, Vol. CAD-4, No. 4, July 1985, pp. 166-177.
 
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W. Maly, M.E. Thomas, J.D. Chian, and M. Campbell, ~'Double-Bridge Test Structure for the Evaluation of Type, Size and Density of Spot Defects", P~esearch Report CMUCAD-87-2, SRC-CMU Center for Computer-Aided Design, Carnegie-Mellon University, February 1987.
 
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W.Maly, J.Ferguson and J.P.Shen, "Systematic Characterization of Physical Defects for Fault Analysis of MOS IC Cells", In Proc. of the International Test Conference 1984, Philadelphia, October 1984, pp. 390-399.
 
19
J.P.Shcn, W.Maly and F.J.Ferguson, "Inductive Fault Analysis of MOS Integrated Circuits", IEEE Design~I"est~ of Computers on Manufacturing Testing, December 1985, pp. 13-26.
 
20
H.Walker and S.W.Director, "Yield Simulation for integralted Circuits", Proc. of ICCAD-88, IEEE, Santa Clara, Sept. 1983, pp. 256-257.
 
21
H. Walker and S. W. Director, "VLASIC: A Catastrophic Fault Yield Simulator for Integrated Circuits", IEEE Trans. on CAD of Integrated Circuits and Systems, Vol. CAD-5, No. 4, October 1986, pp. 541-556.
 
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J. Ferguson , "Ph.D. thesis in preparation."
 
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W. Maly, ~'Fault Models for the NMOS Programmable Logic Array", In Proe. of Custom Integrated Circuits Con feremce, May 1986.
 
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F. Beenker, "Private communication.".
 
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W.Maly and J.Deszczka, "Yield Estimation Model for VLSI Artwork Evaluation", Electronics Letters, Vol. 19, No, 6, Mar. 19~3, pp. 226-227.

CITED BY  15
 
 
 
 
 
 
 
 
 
 
 


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