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Interconnect analysis: from 3-D structures to circuit models
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 36th annual ACM/IEEE Design Automation Conference table of contents
New Orleans, Louisiana, United States
Pages: 910 - 914  
Year of Publication: 1999
ISBN:1-58133-109-7
Authors
M. Kamon  Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA
N. Marques  Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA
Y. Massoud  Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA
L. Silveira  Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA
J. White  Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA
Sponsors
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
M. Kamon: colleagues
N. Marques: colleagues
Y. Massoud: colleagues
L. Silveira: colleagues
J. White: colleagues

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