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ABSTRACT
An approach is presented for modeling board level, package-level, and MCM substrate-level interconnect circuitry based an measured time domain refectometry data. The time-domain scattering parameters of a multiport system are used to extract a SPICE netlist which uses standard elements to match the behavior of the device up to a user-specified cutoff frequency. Linear or nonlinear circuits may be connected to the model ports, and the entire circuit simulated in a standard circuit simulator. Two-port and four-port example microstrip circuits are characterized, and the simulation results are compared with measured data. Delay, reflection transmission, and crosstalk are accurately modeled in each case.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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INDEX TERMS
Primary Classification:
B.
Hardware
B.7
INTEGRATED CIRCUITS
B.7.2
Design Aids
Subjects:
Simulation
Additional Classification:
B.
Hardware
B.7
INTEGRATED CIRCUITS
F.
Theory of Computation
F.2
ANALYSIS OF ALGORITHMS AND PROBLEM COMPLEXITY
F.2.1
Numerical Algorithms and Problems
Subjects:
Computations on matrices
General Terms:
Algorithms,
Design,
Measurement
Keywords:
MCM substrate-level interconnect circuitry,
SPICE netlist,
automatic netlist extraction,
circuit simulator,
crosstalk,
delay,
linear circuits,
measured time domain refectometry data,
measurement-based characterization,
microstrip circuits,
multichip modules,
multiport system,
nonlinear circuits,
off-chip interconnect,
reflection transmission,
time-domain scattering parameters,
user-specified cutoff frequency
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