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Automatic netlist extraction for measurement-based characterization of off-chip interconnect
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Source International Conference on Computer Aided Design archive
Proceedings of the 1996 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California, United States
Pages: 24 - 29  
Year of Publication: 1997
ISBN:0-8186-7597-7
Authors
Steven D. Corey  Dept. of Electrical Engineering, University of Washington, Seattle, Washington
Andrew T. Yang  Dept. of Electrical Engineering, University of Washington, Seattle, Washington
Sponsors
IEEE-CS : Computer Society
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
IEEE Computer Society  Washington, DC, USA
Bibliometrics
Downloads (6 Weeks): 2,   Downloads (12 Months): 9,   Citation Count: 0
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ABSTRACT

An approach is presented for modeling board level, package-level, and MCM substrate-level interconnect circuitry based an measured time domain refectometry data. The time-domain scattering parameters of a multiport system are used to extract a SPICE netlist which uses standard elements to match the behavior of the device up to a user-specified cutoff frequency. Linear or nonlinear circuits may be connected to the model ports, and the entire circuit simulated in a standard circuit simulator. Two-port and four-port example microstrip circuits are characterized, and the simulation results are compared with measured data. Delay, reflection transmission, and crosstalk are accurately modeled in each case.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Steven D. Corey: colleagues
Andrew T. Yang: colleagues

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