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Package and interconnect modeling of the HFA3624, a 2.4GHz RF to IF converter
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 33rd annual Design Automation Conference table of contents
Las Vegas, Nevada, United States
Pages: 2 - 7  
Year of Publication: 1996
ISBN:0-89791-779-0
Authors
Mattan Kamon  Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, Massachusetts
Steven S. Majors  Harris Semiconductor, Melbourne, Florida
Sponsors
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 1,   Downloads (12 Months): 6,   Citation Count: 0
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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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K. Nabors and J. White, "FastCap: A Multipole-Accelerated 3-D Capacitance Extraction Program," IEEE Trans. CAD, vol. 10 no. 10, November 1991, p1447-1459.
 
3
L. Greengard, The Rapid Evaluation of Potential Fields in Particle Systems.Cambridge, Massachusetts: M.I.T. Press, 1988.
 
4
M. Kamon, M. J. Tsuk, and J. White. Fasthenry: A multipoleaccelerated 3-d inductance extraction program. IEEE Transactions on Microwave Theory and Techniques, 42(9):1750-1758, September 1994.
 
5
S. Majors, Generating Bond Diagrams for Packaged IC Verification, Proceedings of the International Cadence Users Group Conference, Oct. 1994.
 
6
R. Lowther, P. Begley, G. Bajor, A. Rivoli: Substrate Parasitics and Dual-Resistivity Substrates. Submitted to IEEE Transactions on Microwave Theory and Techniques.
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Collaborative Colleagues:
Mattan Kamon: colleagues
Steven S. Majors: colleagues

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