Rectangle-packing-based module placement

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Rectangle-packing-based module placement

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International Conference on Computer Aided Design archive
Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design table of contents

San Jose, California, United States

Pages: 472 - 479

Year of Publication: 1995

ISBN:0-8186-7213-7

Authors

Hiroshi Murata	School of Information Science, Japan Advanced Institute of Science and Technology, Tatsunokuchi, Ishikawa 923-12, Japan
Kunihiro Fujiyoshi	School of Information Science, Japan Advanced Institute of Science and Technology, Tatsunokuchi, Ishikawa 923-12, Japan
Shigetoshi Nakatake	School of Information Science, Japan Advanced Institute of Science and Technology, Tatsunokuchi, Ishikawa 923-12, Japan
Yoji Kajitani	Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, Meguro-ku, Tokyo 152, Japan

Sponsors

SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS : Computer Society

Publisher

IEEE Computer Society Washington, DC, USA

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Downloads (6 Weeks): 7, Downloads (12 Months): 101, Citation Count: 100

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ABSTRACT

The first and the most critical stage in VLSI layout design is the placement, the background of which is the rectangle packing problem: Given many rectangular modules of arbitrary size, place them without overlapping on a layer in the smallest bounding rectangle. Since the variety of the packing is infinite (two- dimensionally continuous) many, the key issue for successful optimization is in the introduction of a P-admissible solution space, which is a finite set of solutions at least one of which is optimal. This paper proposes such a solution space where each packing is represented by a pair of module name sequences. Searching this space by simulated annealing, hundreds of modules could be successfully packed as demonstrated. Combining a conventional wiring method, the biggest MCNC benchmark ami49 is challenged.

REFERENCES

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