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Compatibility path based binding algorithm for interconnect reduction in high level synthesis
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Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California
SESSION: High level synthesis table of contents
Pages 435-441  
Year of Publication: 2007
ISBN ~ ISSN:1092-3152 , 1-4244-1382-6
Authors
Taemin Kim  North Carolina State University, Raleigh, NC
Xun Liu  North Carolina State University, Raleigh, NC
Sponsors
: IEEE CASS/CANDE
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS\DATC : IEEE Computer Society
CEDA : Council on Electronic Design Automation
Publisher
IEEE Press  Piscataway, NJ, USA
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ABSTRACT

This paper describes a register and functional unit (FU) binding algorithm in high level synthesis. Our algorithm targets the reduction of multiplexer inputs. Since multiplexers connect multiple inputs to FUs or registers, the multiplexer count is a good indicator of the interconnect complexity. Reducing the number of multiplexer inputs results in reducing interconnect cost. Specifically, our algorithm constructs a weighted and ordered compatibility graph, and binds operations that form a long path in the graph together. As a result, operations with many flow dependencies and common inputs are bound to same FU, leading to a small number of FU inputs. In addition, the operation variables generated by a single FU are assigned to the same register so that connections between FUs and registers are reduced. We have implemented our algorithm within a MATLAB to Verilog conversion tool, and applied it to a suite of benchmark programs. Our experimental results have shown that the proposed scheme achieves 11.8%, 43.6% and 58.8% multiplexer input count reduction on average over weighted bipartite matching algorithm, k-cofamily algorithm and left edge algorithm, respectively. To assess the impact on interconnect reduction, we have generated layouts of the circuits from our Verilog description. It is shown that our approach delivers a 10.1% reduction in total wire-length of global interconnects with minor area overhead of register and FUs in comparison to the best previously proposed scheme.


REFERENCES

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