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Interoperating autosched AP using the high level architecture
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Source Winter Simulation Conference archive
Proceedings of the 37th conference on Winter simulation table of contents
Orlando, Florida
SESSION: Modeling methodology A: distributed methods table of contents
Pages: 394 - 401  
Year of Publication: 2005
ISBN:0-7803-9519-0
Authors
Boon Ping Gan  Singapore Institute of Manufacturing Technology, Singapore
Peter Lendermann  Singapore Institute of Manufacturing Technology, Singapore
Malcolm Yoke Hean Low  Singapore Institute of Manufacturing Technology, Singapore
Stephen J. Turner  Nanyang Technological University, Singapore
Xiaoguang Wang  Nanyang Technological University, Singapore
Simon J. E. Taylor  Brunel University, Uxbridge, UK
Publisher
Winter Simulation Conference 
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Downloads (6 Weeks): 2,   Downloads (12 Months): 12,   Citation Count: 6
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ABSTRACT

The High Level Architecture (HLA) is an IEEE standard for interoperating simulation federates. In this paper, we describe a set of requirements that simulation packages need to satisfy in order to be made interoperable using the HLA standard. AutoSched AP, a commercial off-the-shelf simulation package (CSP) which is widely used in the semiconductor industry, was used as a case study for this interoperation exercise. We demonstrated that a straightforward customization of the CSP through a middleware that provides standard functions for interoperation may not provide a satisfactory solution. A specially optimized time synchronization mechanism needs to be installed to ensure good execution efficiency. Experimental results using a Borderless Fab model that comprises of two factory models show that an optimized time synchronization mechanism results in an execution time that is ten times better than a straightforward application of the HLA Runtime Infrastructure's time synchronization mechanism.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Brooks Automation. 2001. AutoSched AP Customization Guide v 7.0.
 
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CSPI-PDG. 2005. http://www.cspif.com {accessed March 20, 2005}.
 
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IEEE 1516 2000. IEEE Standard for Modeling and Simulation (M&S) High Level Architecture (HLA), New York, NY: Institute of Electrical and Electronics Engineers.
 
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Lendermann, P., N. Julka, B. P. Gan, D. Chen, L. F. McGinnis, and J. P. McGinnis. 2003. Distributed Supply Chain Simulation as a Decision Support Tool for the Semiconductor Industry. Simulation. 79. pp. 126--138.
 
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Strassburger, S., T. Schulze and U. Klein. 1999. Migration of HLA into Civil Domains. SIMULATION. 73(5): 296--303.
 
8
Taylor, S. J. E., S. J. Turner and M. Y. H. Low. 2005. The COTS Simulation Interoperability Product Development Group. Proc. 2005 European Interoperability Workshop. Simulation Interoperability Standards Organization, Institute for Simulation and Training, Florida, 05E-SIW-056.
 
9
Wang, X. G., S. J. Turner, M. Y. H. Low and B. P. Gan. 2004. A Generic Architecture for the Integration of COTS Packages with the HLA, UK Operational Research Society Simulation Workshop, Birmingham, UK, Mar. 23--24, pp. 225--233.
 
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CITED BY  6
 
 
 
 
 
 
Collaborative Colleagues:
Boon Ping Gan: colleagues
Peter Lendermann: colleagues
Malcolm Yoke Hean Low: colleagues
Stephen J. Turner: colleagues
Xiaoguang Wang: colleagues
Simon J. E. Taylor: colleagues