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ABSTRACT
Digital and analog centric load boards have well established board check methodologies as part of their "release to production requirements", while for RF load boards this is still an open research issue. Potential faults on RF load can be caused by mechanical/electrical defects of components and sockets used on the board. Hence, we propose a novel methodology to accurately check/diagnose the RF path using only reflection measurements with suitable terminations of these paths. These reflection measurements and derived 'checker equations' are used to accurately diagnose the RF path on the load board during production test at no extra test cost. A pilot test vehicle is used to demonstrate the practical implementation and production worthiness of the proposed board check and diagnosis methodology. REFERENCES
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