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A probabilistic framework for power-optimal repeater insertion in global interconnects under parameter variations
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Source International Symposium on Low Power Electronics and Design archive
Proceedings of the 2005 international symposium on Low power electronics and design table of contents
San Diego, CA, USA
SESSION: Circuit-level optimizations table of contents
Pages: 131 - 136  
Year of Publication: 2005
ISBN:1-59593-137-6
Authors
Vineet Wason  University of California, Santa Barbara, CA
Kaustav Banerjee  University of California, Santa Barbara, CA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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ABSTRACT

This paper addresses the problem of power dissipation during the buffer insertion phase of interconnect performance optimization in nanometer scale designs taking all significant parameter variations into account. The relative effect of different device, interconnect and environmental variations on delay and different components of power has been studied. A probabilistic framework to optimize buffer-interconnect designs under variations has been presented and results are compared with those obtained through simple deterministic optimization. Also, statistical models for delay and power under parameter variations have been developed using linear regression techniques. Under statistical analysis, both power and performance of buffer-interconnect designs are shown to degrade with increasing amount of variations. Also, % error in power estimation for power-optimal repeater designs is shown to be significant if variations are not taken into account. Furthermore, it has been shown that due to variations, significantly higher penalties in delay are needed to operate at power levels similar to those under no variations. Finally, the percentage savings in total power for a given penalty in delay are shown to improve with increasing amount of parameter variations.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
International Technology Roadmap for Semiconductors (ITRS), SIA, 2003.
 
2
H. B. Bakoglu, Circuits, Interconnections and Packaging for VLSI, Addision-Wesley, 1990.
3
 
4
P. Gelsinger, 41st DAC Keynote, DAC, 2004, (www.dac.com)
 
5
K. Banerjee and A. Mehrotra, "A power-optimal repeater insertion methodology for global interconnects in nanometer designs," IEEE Trans. on Elec Dev., vol. 49, pp. 2001--2007, Nov. 2002.
 
6
 
7
Z. Lin et al., "Circuit sensitivity to interconnect variations," IEEE Trans. on Semiconductor Manufacturing, vol.11, no. 4, pp. 557--568, 1998.
 
8
D. Boning and S. Nassif, "Models of process variations in device and interconnect," Design of high performance microprocessor circuits, A. Chandrakasan et al., Wiley-IEEE Press, 2000.
 
9
K. A. Bowman et al., "Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration," IEEE JSSC, vol. 37, pp. 183--190, Feb. 2002.
10
11
 
12
 
13
14
15
 
16
 
17
K. Banerjee and A. Mehrotra, "Analysis of on-chip inductance effects for distributed RLC interconnects," IEEE Trans. on CAD, vol. 21, no. 8, pp. 904--915, 2002.
 
18
J. Faraway, Linear Models with R, CRC Press, 2004.


Collaborative Colleagues:
Vineet Wason: colleagues
Kaustav Banerjee: colleagues